VOL. XCIV, NO. 247
★ WIDE MOAT STOCKS COMPARISON ★
NO ADVICE
Monday, January 5, 2026
Stock Comparison
Hong Kong Exchanges and Clearing Limited vs BE Semiconductor Industries N.V.
Compare moat strength, market structure, and segment coverage to understand how each company defends its edge.
Hong Kong Exchanges and Clearing Limited
0388.HK · Hong Kong Stock Exchange (HKEX)
Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.
Full stock profile
Dive deeper into Hong Kong Exchanges and Clearing Limited's moat claims, evidence, and risks.
View 0388.HK analysisBE Semiconductor Industries N.V.
BESI · Euronext Amsterdam
Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.
Full stock profile
Dive deeper into BE Semiconductor Industries N.V.'s moat claims, evidence, and risks.
View BESI analysisComparison highlights
- Moat score gap: Hong Kong Exchanges and Clearing Limited leads (92 / 100 vs 75 / 100 for BE Semiconductor Industries N.V.).
- Segment focus: Hong Kong Exchanges and Clearing Limited has 4 segments (52.6% in Cash Markets); BE Semiconductor Industries N.V. has 2 segments (81% in Die Attach (incl. advanced die placement & hybrid bonding)).
- Primary market structure: Monopoly vs Oligopoly. Pricing power: Moderate vs Strong.
- Moat breadth: Hong Kong Exchanges and Clearing Limited has 9 moat types across 5 domains; BE Semiconductor Industries N.V. has 5 across 2.
Primary market context
Hong Kong Exchanges and Clearing Limited
Cash Markets
Exchange-based cash equities trading, clearing and settlement in Hong Kong (including Stock Connect cash markets)
Hong Kong (with Mainland China Connect linkage)
Brokers, banks, proprietary trading firms, and investors; listed issuers via primary/secondary markets
Exchange operator + clearing/settlement/depository operator
52.6%
BE Semiconductor Industries N.V.
Die Attach (incl. advanced die placement & hybrid bonding)
Semiconductor assembly equipment - die attach & advanced die placement/hybrid bonding systems
Global
Semiconductor IDMs, foundries, and OSATs
Capital equipment OEM (back-end/advanced packaging)
81%
Side-by-side metrics
Moat coverage
Shared moat types
Hong Kong Exchanges and Clearing Limited strengths
BE Semiconductor Industries N.V. strengths
Segment mix
Hong Kong Exchanges and Clearing Limited segments
Full profile >Cash Markets
Monopoly
Equity and Financial Derivatives
Monopoly
Commodities (LME and related)
Oligopoly
Data and Connectivity
Quasi-Monopoly
BE Semiconductor Industries N.V. segments
Full profile >Die Attach (incl. advanced die placement & hybrid bonding)
Oligopoly
Packaging & Plating
Competitive
Want the full wide moat stocks list?
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View the moat stocks listCuration & Accuracy
This directory blends AI‑assisted discovery with human curation. Entries are reviewed, edited, and organized with the goal of expanding coverage and sharpening quality over time. Your feedback helps steer improvements (because no single human can capture everything all at once).
Details change. Pricing, features, and availability may be incomplete or out of date. Treat listings as a starting point and verify on the provider’s site before making decisions. If you spot an error or a gap, send a quick note and I’ll adjust.