VOL. XCIV, NO. 247
* WIDE MOAT STOCKS COMPARISON *
NO ADVICE
Monday, December 29, 2025
Stock Comparison
Taiwan Semiconductor Manufacturing Company Limited vs BE Semiconductor Industries N.V.
Compare moat strength, market structure, and segment coverage to understand how each company defends its edge.
Taiwan Semiconductor Manufacturing Company Limited
2330 · Taiwan Stock Exchange
Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.
Full stock profile
Dive deeper into Taiwan Semiconductor Manufacturing Company Limited's moat claims, evidence, and risks.
View 2330 analysisBE Semiconductor Industries N.V.
BESI · Euronext Amsterdam
Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.
Full stock profile
Dive deeper into BE Semiconductor Industries N.V.'s moat claims, evidence, and risks.
View BESI analysisComparison highlights
- Moat score gap: Taiwan Semiconductor Manufacturing Company Limited leads (92 / 100 vs 75 / 100 for BE Semiconductor Industries N.V.).
- Segment focus: Taiwan Semiconductor Manufacturing Company Limited has 3 segments (74% in Leading-edge Foundry (7nm and below)); BE Semiconductor Industries N.V. has 2 segments (81% in Die Attach (incl. advanced die placement & hybrid bonding)).
- Primary market structure: Quasi-Monopoly vs Oligopoly. Pricing power: Strong vs Strong.
- Moat breadth: Taiwan Semiconductor Manufacturing Company Limited has 7 moat types across 4 domains; BE Semiconductor Industries N.V. has 5 across 2.
Primary market context
Taiwan Semiconductor Manufacturing Company Limited
Leading-edge Foundry (7nm and below)
Leading-edge semiconductor foundry services (<=7nm logic process technologies)
Global
Fabless semiconductor companies, system companies, and IDMs
Dedicated foundry / contract manufacturer
74%
BE Semiconductor Industries N.V.
Die Attach (incl. advanced die placement & hybrid bonding)
Semiconductor assembly equipment - die attach & advanced die placement/hybrid bonding systems
Global
Semiconductor IDMs, foundries, and OSATs
Capital equipment OEM (back-end/advanced packaging)
81%
Side-by-side metrics
Moat coverage
Shared moat types
Taiwan Semiconductor Manufacturing Company Limited strengths
BE Semiconductor Industries N.V. strengths
Segment mix
Taiwan Semiconductor Manufacturing Company Limited segments
Full profile >Leading-edge Foundry (7nm and below)
Quasi-Monopoly
Mature & Specialty Foundry (16nm and above + specialty processes)
Oligopoly
Advanced Packaging & 3DFabric (CoWoS, InFO, SoIC)
Oligopoly
BE Semiconductor Industries N.V. segments
Full profile >Die Attach (incl. advanced die placement & hybrid bonding)
Oligopoly
Packaging & Plating
Competitive
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View the moat stocks listCuration & Accuracy
This directory blends AI‑assisted discovery with human curation. Entries are reviewed, edited, and organized with the goal of expanding coverage and sharpening quality over time. Your feedback helps steer improvements (because no single human can capture everything all at once).
Details change. Pricing, features, and availability may be incomplete or out of date. Treat listings as a starting point and verify on the provider’s site before making decisions. If you spot an error or a gap, send a quick note and I’ll adjust.