VOL. XCIV, NO. 247

★ WIDE MOAT STOCKS COMPARISON ★

NO ADVICE

Wednesday, December 31, 2025

Stock Comparison

Becton, Dickinson and Company vs BE Semiconductor Industries N.V.

Compare moat strength, market structure, and segment coverage to understand how each company defends its edge.

Becton, Dickinson and Company

BDX · New York Stock Exchange

Market cap (USD)
SectorHealthcare
CountryUS
Data as of2025-12-31
Moat score
66/ 100

Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.

Full stock profile

Dive deeper into Becton, Dickinson and Company's moat claims, evidence, and risks.

View BDX analysis

BE Semiconductor Industries N.V.

BESI · Euronext Amsterdam

Market cap (USD)
SectorTechnology
CountryNL
Data as of2025-12-28
Moat score
75/ 100

Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.

Full stock profile

Dive deeper into BE Semiconductor Industries N.V.'s moat claims, evidence, and risks.

View BESI analysis

Comparison highlights

  • Moat score gap: BE Semiconductor Industries N.V. leads (75 / 100 vs 66 / 100 for Becton, Dickinson and Company).
  • Segment focus: Becton, Dickinson and Company has 5 segments (29.5% in Medical Essentials); BE Semiconductor Industries N.V. has 2 segments (81% in Die Attach (incl. advanced die placement & hybrid bonding)).
  • Primary market structure: Competitive vs Oligopoly. Pricing power: Weak vs Strong.
  • Moat breadth: Becton, Dickinson and Company has 7 moat types across 3 domains; BE Semiconductor Industries N.V. has 5 across 2.

Primary market context

Becton, Dickinson and Company

Medical Essentials

Market

Single-use medical consumables and specimen collection systems

Geography

Global

Customer

Healthcare providers and clinical labs

Role

Manufacturer

Revenue share

29.5%

BE Semiconductor Industries N.V.

Die Attach (incl. advanced die placement & hybrid bonding)

Market

Semiconductor assembly equipment - die attach & advanced die placement/hybrid bonding systems

Geography

Global

Customer

Semiconductor IDMs, foundries, and OSATs

Role

Capital equipment OEM (back-end/advanced packaging)

Revenue share

81%

Side-by-side metrics

Becton, Dickinson and Company
BE Semiconductor Industries N.V.
Ticker / Exchange
BDX - New York Stock Exchange
BESI - Euronext Amsterdam
Market cap (USD)
n/a
n/a
Sector
Healthcare
Technology
HQ country
US
NL
Primary segment
Medical Essentials
Die Attach (incl. advanced die placement & hybrid bonding)
Market structure
Competitive
Oligopoly
Market share
n/a
42%-44% (reported)
HHI estimate
n/a
n/a
Pricing power
Weak
Strong
Moat score
66 / 100
75 / 100
Moat domains
Demand, Supply, Legal
Supply, Demand
Last update
2025-12-31
2025-12-28

Moat coverage

Shared moat types

Installed Base ConsumablesDesign In QualificationSwitching Costs General

Becton, Dickinson and Company strengths

Operational ExcellenceCompliance AdvantageData Workflow LockinLong Term Contracts

BE Semiconductor Industries N.V. strengths

Capex Knowhow ScaleService Field Network

Segment mix

Becton, Dickinson and Company segments

Full profile >

Medical Essentials

Competitive

29.5%

Connected Care

Oligopoly

20.9%

BioPharma Systems

Oligopoly

10.6%

Interventional

Competitive

23.9%

Life Sciences

Oligopoly

15.1%

BE Semiconductor Industries N.V. segments

Full profile >

Die Attach (incl. advanced die placement & hybrid bonding)

Oligopoly

81%

Packaging & Plating

Competitive

19%

Want the full wide moat stocks list?

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Curation & Accuracy

This directory blends AI‑assisted discovery with human curation. Entries are reviewed, edited, and organized with the goal of expanding coverage and sharpening quality over time. Your feedback helps steer improvements (because no single human can capture everything all at once).

Details change. Pricing, features, and availability may be incomplete or out of date. Treat listings as a starting point and verify on the provider’s site before making decisions. If you spot an error or a gap, send a quick note and I’ll adjust.