VOL. XCIV, NO. 247

* WIDE MOAT STOCKS COMPARISON *

NO ADVICE

Monday, December 29, 2025

Stock Comparison

The Boeing Company vs BE Semiconductor Industries N.V.

Compare moat strength, market structure, and segment coverage to understand how each company defends its edge.

The Boeing Company

BA · New York Stock Exchange

Market cap (USD)
SectorIndustrials
CountryUS
Data as of2025-12-23
Moat score
61/ 100

Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.

Full stock profile

Dive deeper into The Boeing Company's moat claims, evidence, and risks.

View BA analysis

BE Semiconductor Industries N.V.

BESI · Euronext Amsterdam

Market cap (USD)
SectorTechnology
CountryNL
Data as of2025-12-28
Moat score
75/ 100

Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.

Full stock profile

Dive deeper into BE Semiconductor Industries N.V.'s moat claims, evidence, and risks.

View BESI analysis

Comparison highlights

  • Moat score gap: BE Semiconductor Industries N.V. leads (75 / 100 vs 61 / 100 for The Boeing Company).
  • Segment focus: The Boeing Company has 3 segments (35.8% in Defense, Space & Security (BDS)); BE Semiconductor Industries N.V. has 2 segments (81% in Die Attach (incl. advanced die placement & hybrid bonding)).
  • Primary market structure: Oligopoly vs Oligopoly. Pricing power: Weak vs Strong.
  • Moat breadth: The Boeing Company has 9 moat types across 3 domains; BE Semiconductor Industries N.V. has 5 across 2.

Primary market context

The Boeing Company

Defense, Space & Security (BDS)

Market

Defense aerospace & space prime contracting (air, space, and mission systems)

Geography

Primarily U.S., with international programs

Customer

U.S. and allied governments; defense agencies

Role

Prime contractor / systems integrator

Revenue share

35.8%

BE Semiconductor Industries N.V.

Die Attach (incl. advanced die placement & hybrid bonding)

Market

Semiconductor assembly equipment - die attach & advanced die placement/hybrid bonding systems

Geography

Global

Customer

Semiconductor IDMs, foundries, and OSATs

Role

Capital equipment OEM (back-end/advanced packaging)

Revenue share

81%

Side-by-side metrics

The Boeing Company
BE Semiconductor Industries N.V.
Ticker / Exchange
BA - New York Stock Exchange
BESI - Euronext Amsterdam
Market cap (USD)
n/a
n/a
Sector
Industrials
Technology
HQ country
US
NL
Primary segment
Defense, Space & Security (BDS)
Die Attach (incl. advanced die placement & hybrid bonding)
Market structure
Oligopoly
Oligopoly
Market share
n/a
42%-44% (reported)
HHI estimate
n/a
n/a
Pricing power
Weak
Strong
Moat score
61 / 100
75 / 100
Moat domains
Legal, Supply, Demand
Supply, Demand
Last update
2025-12-23
2025-12-28

Moat coverage

Shared moat types

Capex Knowhow ScaleDesign In QualificationService Field NetworkInstalled Base Consumables

The Boeing Company strengths

Regulated Standards PipeGovernment Contracting RelationshipsLong Term ContractsCompliance AdvantageData Workflow Lockin

BE Semiconductor Industries N.V. strengths

Switching Costs General

Segment mix

The Boeing Company segments

Full profile >

Commercial Airplanes (BCA)

Duopoly

34.3%

Defense, Space & Security (BDS)

Oligopoly

35.8%

Global Services (BGS)

Competitive

29.9%

BE Semiconductor Industries N.V. segments

Full profile >

Die Attach (incl. advanced die placement & hybrid bonding)

Oligopoly

81%

Packaging & Plating

Competitive

19%

Want the full wide moat stocks list?

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Curation & Accuracy

This directory blends AI‑assisted discovery with human curation. Entries are reviewed, edited, and organized with the goal of expanding coverage and sharpening quality over time. Your feedback helps steer improvements (because no single human can capture everything all at once).

Details change. Pricing, features, and availability may be incomplete or out of date. Treat listings as a starting point and verify on the provider’s site before making decisions. If you spot an error or a gap, send a quick note and I’ll adjust.