VOL. XCIV, NO. 247
★ WIDE MOAT STOCKS COMPARISON ★
NO ADVICE
Wednesday, December 31, 2025
Stock Comparison
Broadcom Inc. vs BE Semiconductor Industries N.V.
Compare moat strength, market structure, and segment coverage to understand how each company defends its edge.
Broadcom Inc.
AVGO · NASDAQ Global Select Market
Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.
Full stock profile
Dive deeper into Broadcom Inc.'s moat claims, evidence, and risks.
View AVGO analysisBE Semiconductor Industries N.V.
BESI · Euronext Amsterdam
Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.
Full stock profile
Dive deeper into BE Semiconductor Industries N.V.'s moat claims, evidence, and risks.
View BESI analysisComparison highlights
- Moat score gap: BE Semiconductor Industries N.V. leads (75 / 100 vs 66 / 100 for Broadcom Inc.).
- Segment focus: Broadcom Inc. has 2 segments (57.7% in Semiconductor Solutions); BE Semiconductor Industries N.V. has 2 segments (81% in Die Attach (incl. advanced die placement & hybrid bonding)).
- Primary market structure: Oligopoly vs Oligopoly. Pricing power: Moderate vs Strong.
- Moat breadth: Broadcom Inc. has 8 moat types across 4 domains; BE Semiconductor Industries N.V. has 5 across 2.
Primary market context
Broadcom Inc.
Semiconductor Solutions
Fabless semiconductor solutions (data center and AI networking/custom silicon, connectivity, broadband, storage, industrial) plus semiconductor IP licensing
Global
Hyperscalers, OEMs, and contract manufacturers; sold via direct sales and distributors
Fabless chip designer and IP licensor; outsources most wafer manufacturing and assembly/test
57.7%
BE Semiconductor Industries N.V.
Die Attach (incl. advanced die placement & hybrid bonding)
Semiconductor assembly equipment - die attach & advanced die placement/hybrid bonding systems
Global
Semiconductor IDMs, foundries, and OSATs
Capital equipment OEM (back-end/advanced packaging)
81%
Side-by-side metrics
Moat coverage
Shared moat types
Broadcom Inc. strengths
BE Semiconductor Industries N.V. strengths
Segment mix
Broadcom Inc. segments
Full profile >Semiconductor Solutions
Oligopoly
Infrastructure Software
Oligopoly
BE Semiconductor Industries N.V. segments
Full profile >Die Attach (incl. advanced die placement & hybrid bonding)
Oligopoly
Packaging & Plating
Competitive
Want the full wide moat stocks list?
Browse the full ranking of wide moat stocks, updated with moat scores and segment context.
View the moat stocks listCuration & Accuracy
This directory blends AI‑assisted discovery with human curation. Entries are reviewed, edited, and organized with the goal of expanding coverage and sharpening quality over time. Your feedback helps steer improvements (because no single human can capture everything all at once).
Details change. Pricing, features, and availability may be incomplete or out of date. Treat listings as a starting point and verify on the provider’s site before making decisions. If you spot an error or a gap, send a quick note and I’ll adjust.