VOL. XCIV, NO. 247

★ WIDE MOAT STOCKS & COMPETITIVE ADVANTAGES ★

PRICE: 0 CENTS

Wednesday, December 31, 2025

ANSYS, Inc.

ANSS · Nasdaq Global Select Market

Market cap (USD)
SectorTechnology
CountryUS
Data as of
Moat score
68/ 100

Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.

Request update

Spot something outdated? Send a quick note and source so we can refresh this profile.

Overview

ANSYS, Inc. develops and markets engineering simulation software and services used across industrial and high-tech workflows. The company was acquired by Synopsys in July 2025 and its former NASDAQ listing (ANSS) was suspended shortly after. The core moat is demand-driven: embedded workflows with high renewal dynamics and a broad multiphysics platform that supports suite bundling. In semiconductor sign-off tooling, qualification and foundry certification raise switching costs and reinforce incumbency. Adjacent offerings include digital mission engineering and safety-certified embedded software/cybersecurity analysis tooling.

Primary segment

Core Multiphysics Simulation Platform (CAE)

Market structure

Oligopoly

Market share

HHI:

Coverage

3 segments · 6 tags

Updated 2025-12-31

Segments

Core Multiphysics Simulation Platform (CAE)

Multiphysics engineering simulation (CAE) software

Revenue

Structure

Oligopoly

Pricing

moderate

Share

Peers

ADSKALTRDSY.PAHEXA-B.ST+2

Electronics & Semiconductor Simulation (EDA-adjacent)

Electronics and semiconductor simulation / sign-off (power integrity, EM, photonics)

Revenue

Structure

Oligopoly

Pricing

strong

Share

Peers

CDNSKEYSSNPS

Digital Mission Engineering & Safety-Critical Tooling

Digital mission engineering, safety analysis, and safety-certified embedded software tooling

Revenue

Structure

Competitive

Pricing

moderate

Share

Peers

BALHXRTX

Moat Claims

Core Multiphysics Simulation Platform (CAE)

Multiphysics engineering simulation (CAE) software

Oligopoly

Suite Bundling

Demand

Strength: 4/5 · Durability: durable · Confidence: 4/5 · 1 evidence

Ansys positions its offering as a unified multiphysics platform spanning many physics domains, which supports selling multi-product bundles and enterprise-wide deployments rather than isolated point tools.

Erosion risks

  • Aggressive suite bundling by CAD/PLM incumbents
  • Cloud-native and open-source alternatives improving
  • Procurement-driven unbundling in cost-down cycles

Leading indicators

  • Multi-product deal mix trend
  • Average contract duration trend
  • ACV growth vs. customer count growth

Counterarguments

  • Best-of-breed point solvers can win in specific niches
  • Large incumbents (e.g., Siemens/Dassault) also offer integrated suites

Switching Costs General

Demand

Strength: 4/5 · Durability: durable · Confidence: 4/5 · 1 evidence

Mission-critical simulation is embedded in engineering workflows and programs, with long-lived models/processes and high retraining/revalidation costs; recurring contracts with strong renewal dynamics suggest meaningful customer lock-in.

Erosion risks

  • Customer standardization onto competitor platforms after M&A
  • Increased use of internal or open tooling in cost-cutting environments
  • Talent mobility reducing tool-specific switching friction over time

Leading indicators

  • Renewal rate and churn disclosures (if resumed post-merger)
  • Net expansion / upsell indicators (ACV recurring growth)
  • Discounting intensity in renewals

Counterarguments

  • Enterprises can and do dual-source simulation tools
  • Switching may be feasible at major program resets or new platform launches

Data Workflow Lockin

Demand

Strength: 3/5 · Durability: durable · Confidence: 3/5 · 1 evidence

Knowledge management and simulation process tooling can increase lock-in by centralizing simulation artifacts, traceability, and cross-team workflows around the platform.

Erosion risks

  • Customer preference for vendor-neutral PLM/ALM data layers
  • Interoperability and open APIs reducing lock-in
  • Cloud platforms (hyperscalers) commoditizing workflow layers

Leading indicators

  • Attach rate of workflow/knowledge management tooling
  • Integrations with third-party lifecycle tools
  • Customer references citing traceability/digital thread outcomes

Counterarguments

  • Engineering orgs may treat workflow tooling as optional and keep data in neutral repositories

Electronics & Semiconductor Simulation (EDA-adjacent)

Electronics and semiconductor simulation / sign-off (power integrity, EM, photonics)

Oligopoly

Design In Qualification

Demand

Strength: 5/5 · Durability: durable · Confidence: 4/5 · 1 evidence

In semiconductor sign-off workflows, tool qualification and foundry certification create very high barriers to switching; being embedded in sign-off makes the software difficult to displace once designed-in.

Erosion risks

  • Competing sign-off solutions gaining foundry certification
  • Platform bundling pressure from EDA suite incumbents
  • Regulatory remedies or divestitures reducing product scope

Leading indicators

  • Foundry certification breadth for new nodes
  • Win/loss commentary in semiconductor sign-off deals
  • Design starts in advanced packaging / 3D-IC

Counterarguments

  • Large customers can mandate multi-vendor sign-off strategies
  • Foundries can certify competing tools if demand warrants

De Facto Standard

Network

Strength: 4/5 · Durability: durable · Confidence: 3/5 · 1 evidence

Described as a 'gold standard' in a key sign-off niche, which can produce standardization benefits and strong incumbency advantages.

Erosion risks

  • Standards shifting with new architectures (chiplets/3D-IC) and new verification paradigms
  • EDA incumbents bundling sign-off into broader suites

Leading indicators

  • Mentions of 'gold standard' positioning in technical ecosystems and foundry collateral
  • Customer migrations at major node transitions

Counterarguments

  • 'Gold standard' language may reflect marketing and may not imply dominance in every sub-segment

Ecosystem Complements

Network

Strength: 3/5 · Durability: medium · Confidence: 3/5 · 1 evidence

Interoperability with third-party platforms and design automation tools plus cloud/HPC scaling can make the product easier to embed into existing EDA ecosystems (complements moat), increasing adoption and stickiness.

Erosion risks

  • Interoperability can reduce switching costs by enabling easier substitution
  • Hyperscaler-native workflows could weaken vendor ecosystem positioning

Leading indicators

  • Number/quality of integrations in EDA workflows
  • Cloud-based deployment adoption in sign-off workloads

Counterarguments

  • Ecosystem integration is table stakes in EDA and may not be a differentiator

Digital Mission Engineering & Safety-Critical Tooling

Digital mission engineering, safety analysis, and safety-certified embedded software tooling

Competitive

Compliance Advantage

Legal

Strength: 4/5 · Durability: durable · Confidence: 3/5 · 1 evidence

Safety-critical embedded software tooling that supports automated certification can create compliance-related differentiation and reduce customer burden versus general-purpose tools.

Erosion risks

  • Standards changes requiring retooling and recertification
  • Competition from incumbents in model-based engineering toolchains
  • Government procurement shifts and budget volatility

Leading indicators

  • Adoption in safety-critical programs (aerospace/rail/automotive)
  • References to certification time/cost reductions in customer cases

Counterarguments

  • Some organizations rely on internal processes and general-purpose tools for certification artifacts

Switching Costs General

Demand

Strength: 3/5 · Durability: medium · Confidence: 3/5 · 1 evidence

Once embedded in long-lived, safety-critical programs, tool and workflow changes are costly (retraining, revalidation, and process updates), which raises switching frictions.

Erosion risks

  • Program resets enabling tool replacement
  • Move to open standards and interoperable model formats

Leading indicators

  • Retention/renewal performance in safety-critical verticals
  • Growth in program-level deployments vs. pilot projects

Counterarguments

  • Switching can happen at major platform refreshes or supplier re-competes

Data Workflow Lockin

Demand

Strength: 3/5 · Durability: medium · Confidence: 3/5 · 1 evidence

Mission-level modeling and simulation that spans many phases of the lifecycle can become a central workflow layer, making it harder to replace without disrupting planning, verification, and operations modeling.

Erosion risks

  • Customers consolidating on broader systems engineering platforms
  • Interoperability reducing lock-in to any single vendor

Leading indicators

  • Expansion from modeling into operations/mission planning use cases
  • Integrations with customer ecosystems and data sources

Counterarguments

  • Some customers keep mission modeling in-house or on government platforms

Evidence

sec_filing
ANSYS, Inc. Form 10-K (FY ended 2024-12-31)

unified engineering simulation environment

Supports the claim that Ansys sells a platform spanning multiple physics domains, enabling suite-style bundling.

sec_filing
ANSYS, Inc. Form 10-K (FY ended 2024-12-31)

high rate of customer renewal

Supports the idea of sticky recurring relationships (renewal-heavy maintenance/subscription contracts), consistent with switching costs.

sec_filing
ANSYS, Inc. Form 10-K (FY ended 2024-12-31)

critical simulation data

Supports that Ansys offers tooling intended to secure and manage simulation artifacts/workflows, increasing workflow/data stickiness.

sec_filing
ANSYS, Inc. Form 10-K (FY ended 2024-12-31)

analysis and sign-off

Supports that Ansys describes a flagship EDA tool used for IC analysis and sign-off, consistent with qualification-driven switching costs.

sec_filing
ANSYS, Inc. Form 10-K (FY ended 2024-12-31)

gold standard

Supports the claim of strong incumbency/standard positioning in a sign-off use case.

Showing 5 of 9 sources.

Risks & Indicators

Erosion risks

  • Aggressive suite bundling by CAD/PLM incumbents
  • Cloud-native and open-source alternatives improving
  • Procurement-driven unbundling in cost-down cycles
  • Customer standardization onto competitor platforms after M&A
  • Increased use of internal or open tooling in cost-cutting environments
  • Talent mobility reducing tool-specific switching friction over time

Leading indicators

  • Multi-product deal mix trend
  • Average contract duration trend
  • ACV growth vs. customer count growth
  • Renewal rate and churn disclosures (if resumed post-merger)
  • Net expansion / upsell indicators (ACV recurring growth)
  • Discounting intensity in renewals
Created 2025-12-31
Updated 2025-12-31

Curation & Accuracy

This directory blends AI‑assisted discovery with human curation. Entries are reviewed, edited, and organized with the goal of expanding coverage and sharpening quality over time. Your feedback helps steer improvements (because no single human can capture everything all at once).

Details change. Pricing, features, and availability may be incomplete or out of date. Treat listings as a starting point and verify on the provider’s site before making decisions. If you spot an error or a gap, send a quick note and I’ll adjust.