VOL. XCIV, NO. 247

★ WIDE MOAT STOCKS COMPARISON ★

NO ADVICE

Wednesday, December 31, 2025

Stock Comparison

Accenture plc vs BE Semiconductor Industries N.V.

Compare moat strength, market structure, and segment coverage to understand how each company defends its edge.

Accenture plc

ACN · New York Stock Exchange

Market cap (USD)
SectorTechnology
CountryIE
Data as of2025-12-30
Moat score
66/ 100

Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.

Full stock profile

Dive deeper into Accenture plc's moat claims, evidence, and risks.

View ACN analysis

BE Semiconductor Industries N.V.

BESI · Euronext Amsterdam

Market cap (USD)
SectorTechnology
CountryNL
Data as of2025-12-28
Moat score
75/ 100

Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.

Full stock profile

Dive deeper into BE Semiconductor Industries N.V.'s moat claims, evidence, and risks.

View BESI analysis

Comparison highlights

  • Moat score gap: BE Semiconductor Industries N.V. leads (75 / 100 vs 66 / 100 for Accenture plc).
  • Segment focus: Accenture plc has 2 segments (50.4% in Consulting); BE Semiconductor Industries N.V. has 2 segments (81% in Die Attach (incl. advanced die placement & hybrid bonding)).
  • Primary market structure: Competitive vs Oligopoly. Pricing power: n/a vs Strong.
  • Moat breadth: Accenture plc has 7 moat types across 3 domains; BE Semiconductor Industries N.V. has 5 across 2.

Primary market context

Accenture plc

Consulting

Market

Enterprise consulting (strategy, management, technology consulting and technology integration consulting)

Geography

Global

Customer

Enterprises and public sector organizations

Role

Advisor and systems integrator / implementation partner

Revenue share

50.4%

BE Semiconductor Industries N.V.

Die Attach (incl. advanced die placement & hybrid bonding)

Market

Semiconductor assembly equipment - die attach & advanced die placement/hybrid bonding systems

Geography

Global

Customer

Semiconductor IDMs, foundries, and OSATs

Role

Capital equipment OEM (back-end/advanced packaging)

Revenue share

81%

Side-by-side metrics

Accenture plc
BE Semiconductor Industries N.V.
Ticker / Exchange
ACN - New York Stock Exchange
BESI - Euronext Amsterdam
Market cap (USD)
n/a
n/a
Sector
Technology
Technology
HQ country
IE
NL
Primary segment
Consulting
Die Attach (incl. advanced die placement & hybrid bonding)
Market structure
Competitive
Oligopoly
Market share
n/a
42%-44% (reported)
HHI estimate
n/a
n/a
Pricing power
n/a
Strong
Moat score
66 / 100
75 / 100
Moat domains
Demand, Supply, Network
Supply, Demand
Last update
2025-12-30
2025-12-28

Moat coverage

Shared moat types

Service Field NetworkSwitching Costs General

Accenture plc strengths

Brand TrustProcurement InertiaSuite BundlingLong Term ContractsEcosystem Complements

BE Semiconductor Industries N.V. strengths

Capex Knowhow ScaleDesign In QualificationInstalled Base Consumables

Segment mix

Accenture plc segments

Full profile >

Consulting

Competitive

50.4%

Managed Services

Oligopoly

49.6%

BE Semiconductor Industries N.V. segments

Full profile >

Die Attach (incl. advanced die placement & hybrid bonding)

Oligopoly

81%

Packaging & Plating

Competitive

19%

Want the full wide moat stocks list?

Browse the full ranking of wide moat stocks, updated with moat scores and segment context.

View the moat stocks list

Curation & Accuracy

This directory blends AI‑assisted discovery with human curation. Entries are reviewed, edited, and organized with the goal of expanding coverage and sharpening quality over time. Your feedback helps steer improvements (because no single human can capture everything all at once).

Details change. Pricing, features, and availability may be incomplete or out of date. Treat listings as a starting point and verify on the provider’s site before making decisions. If you spot an error or a gap, send a quick note and I’ll adjust.