VOL. XCIV, NO. 247

★ WIDE MOAT STOCKS COMPARISON ★

NO ADVICE

Wednesday, December 31, 2025

Stock Comparison

ANSYS, Inc. vs BE Semiconductor Industries N.V.

Compare moat strength, market structure, and segment coverage to understand how each company defends its edge.

ANSYS, Inc.

ANSS · Nasdaq Global Select Market

Market cap (USD)
SectorTechnology
CountryUS
Data as of2025-12-31
Moat score
68/ 100

Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.

Full stock profile

Dive deeper into ANSYS, Inc.'s moat claims, evidence, and risks.

View ANSS analysis

BE Semiconductor Industries N.V.

BESI · Euronext Amsterdam

Market cap (USD)
SectorTechnology
CountryNL
Data as of2025-12-28
Moat score
75/ 100

Weighted average of segment moat scores, combining moat strength, durability, confidence, market structure, pricing power, and market share.

Full stock profile

Dive deeper into BE Semiconductor Industries N.V.'s moat claims, evidence, and risks.

View BESI analysis

Comparison highlights

  • Moat score gap: BE Semiconductor Industries N.V. leads (75 / 100 vs 68 / 100 for ANSYS, Inc.).
  • Segment focus: ANSYS, Inc. has 3 segments; BE Semiconductor Industries N.V. has 2 segments (81% in Die Attach (incl. advanced die placement & hybrid bonding)).
  • Primary market structure: Oligopoly vs Oligopoly. Pricing power: Moderate vs Strong.
  • Moat breadth: ANSYS, Inc. has 7 moat types across 3 domains; BE Semiconductor Industries N.V. has 5 across 2.

Primary market context

ANSYS, Inc.

Core Multiphysics Simulation Platform (CAE)

Market

Multiphysics engineering simulation (CAE) software

Geography

Global

Customer

Enterprises and academia

Role

Engineering design, verification, and validation software

BE Semiconductor Industries N.V.

Die Attach (incl. advanced die placement & hybrid bonding)

Market

Semiconductor assembly equipment - die attach & advanced die placement/hybrid bonding systems

Geography

Global

Customer

Semiconductor IDMs, foundries, and OSATs

Role

Capital equipment OEM (back-end/advanced packaging)

Revenue share

81%

Side-by-side metrics

ANSYS, Inc.
BE Semiconductor Industries N.V.
Ticker / Exchange
ANSS - Nasdaq Global Select Market
BESI - Euronext Amsterdam
Market cap (USD)
n/a
n/a
Sector
Technology
Technology
HQ country
US
NL
Primary segment
Core Multiphysics Simulation Platform (CAE)
Die Attach (incl. advanced die placement & hybrid bonding)
Market structure
Oligopoly
Oligopoly
Market share
n/a
42%-44% (reported)
HHI estimate
n/a
n/a
Pricing power
Moderate
Strong
Moat score
68 / 100
75 / 100
Moat domains
Demand, Network, Legal
Supply, Demand
Last update
2025-12-31
2025-12-28

Moat coverage

Shared moat types

Switching Costs GeneralDesign In Qualification

ANSYS, Inc. strengths

Suite BundlingData Workflow LockinDe Facto StandardEcosystem ComplementsCompliance Advantage

BE Semiconductor Industries N.V. strengths

Capex Knowhow ScaleInstalled Base ConsumablesService Field Network

Segment mix

ANSYS, Inc. segments

Full profile >

Core Multiphysics Simulation Platform (CAE)

Oligopoly

n/a

Electronics & Semiconductor Simulation (EDA-adjacent)

Oligopoly

n/a

Digital Mission Engineering & Safety-Critical Tooling

Competitive

n/a

BE Semiconductor Industries N.V. segments

Full profile >

Die Attach (incl. advanced die placement & hybrid bonding)

Oligopoly

81%

Packaging & Plating

Competitive

19%

Want the full wide moat stocks list?

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Curation & Accuracy

This directory blends AI‑assisted discovery with human curation. Entries are reviewed, edited, and organized with the goal of expanding coverage and sharpening quality over time. Your feedback helps steer improvements (because no single human can capture everything all at once).

Details change. Pricing, features, and availability may be incomplete or out of date. Treat listings as a starting point and verify on the provider’s site before making decisions. If you spot an error or a gap, send a quick note and I’ll adjust.